EFM8BB31F64G-C-QSOP24
vs
EFM8BB31F64A-B-4QFN24
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2019-01-22
|
2017-07-28
|
| Samacsys Manufacturer |
Silicon Labs
|
Silicon Labs
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
8051
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-609 Code |
e3
|
|
| Length |
8.65 mm
|
4 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of I/O Lines |
21
|
20
|
| Number of Terminals |
24
|
24
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Code |
SSOP
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| RAM (bytes) |
4352
|
4352
|
| ROM (words) |
65536
|
65536
|
| ROM Programmability |
FLASH
|
FLASH
|
| Speed |
50 MHz
|
50 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
2.2 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.635 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
,
|
| Boundary Scan |
|
NO
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-30 Code |
|
S-XQCC-N24
|
| Low Power Mode |
|
YES
|
| Number of External Interrupts |
|
2
|
| Number of Serial I/Os |
|
2
|
| Number of Timers |
|
7
|
| On Chip Data RAM Width |
|
8
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Equivalence Code |
|
LCC24,.16SQ,20
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
0.8 mm
|
| Supply Current-Max |
|
14.4 mA
|
| Technology |
|
CMOS
|
|
|
|
Compare EFM8BB31F64G-C-QSOP24 with alternatives
Compare EFM8BB31F64A-B-4QFN24 with alternatives