EFM8BB31F64G-B-QSOP24R
vs
EFM8BB31F64G-A-QSOP24
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Package Description |
,
|
,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
|
Address Bus Width |
|
|
Bit Size |
8
|
|
Boundary Scan |
NO
|
|
CPU Family |
8051
|
|
Clock Frequency-Max |
50 MHz
|
|
DAC Channels |
YES
|
|
DMA Channels |
NO
|
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
R-PDSO-G24
|
|
JESD-609 Code |
e3
|
|
Length |
8.65 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
2
|
|
Number of External Interrupts |
2
|
|
Number of I/O Lines |
21
|
|
Number of Serial I/Os |
2
|
|
Number of Terminals |
24
|
|
Number of Timers |
7
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
SSOP
|
|
Package Equivalence Code |
SSOP24,.25
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
|
Peak Reflow Temperature (Cel) |
260
|
|
RAM (bytes) |
4352
|
|
ROM (words) |
65536
|
|
ROM Programmability |
FLASH
|
|
Seated Height-Max |
1.75 mm
|
|
Speed |
50 MHz
|
|
Supply Current-Max |
14.4 mA
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.635 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
3.9 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EFM8BB31F64G-B-QSOP24R with alternatives
Compare EFM8BB31F64G-A-QSOP24 with alternatives