EFM8BB31F16I-C-5QFN32
vs
EFM8BB31F16I-C-4QFN24
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2019-01-22
|
2019-01-22
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
8051
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N24
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
3 mm
|
Moisture Sensitivity Level |
2
|
2
|
Number of I/O Lines |
29
|
20
|
Number of Terminals |
32
|
24
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
RAM (bytes) |
2304
|
2304
|
ROM (words) |
16384
|
16384
|
ROM Programmability |
FLASH
|
FLASH
|
Speed |
50 MHz
|
50 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2.2 V
|
2.2 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
4 mm
|
3 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
Silicon Labs
|
|
|
|
Compare EFM8BB31F16I-C-5QFN32 with alternatives
Compare EFM8BB31F16I-C-4QFN24 with alternatives