EFM8BB31F16G-B-QFN24R
vs
EFM8BB31F16G-C-QSOP24R
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SILICON LABORATORIES INC
SILICON LABORATORIES INC
Package Description
,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
CPU Family
8051
Clock Frequency-Max
50 MHz
50 MHz
DAC Channels
YES
DMA Channels
NO
YES
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-XQCC-N24
JESD-609 Code
e3
e3
Length
3 mm
8.65 mm
Low Power Mode
YES
Moisture Sensitivity Level
2
2
Number of External Interrupts
2
Number of I/O Lines
20
21
Number of Serial I/Os
2
Number of Terminals
24
24
Number of Timers
7
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
UNSPECIFIED
Package Code
HVQCCN
SSOP
Package Equivalence Code
LCC24,.12SQ,16
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
RAM (bytes)
2304
ROM (words)
16384
ROM Programmability
FLASH
Seated Height-Max
0.9 mm
Speed
50 MHz
50 MHz
Supply Current-Max
14.4 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
2.2 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.4 mm
0.635 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
3 mm
3.9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Date Of Intro
2019-01-22
Compare EFM8BB31F16G-B-QFN24R with alternatives
Compare EFM8BB31F16G-C-QSOP24R with alternatives