EFM32TG110F4-D-QFN24
vs
ATSAML11D14A-YF
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
5A992.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2019-12-11
|
2018-06-19
|
| Samacsys Manufacturer |
Silicon Labs
|
Microchip
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
CORTEX-M3
|
CORTEX-M23
|
| Clock Frequency-Max |
32 MHz
|
32 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-XQCC-N24
|
R-PDSO-G24
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
8.2 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of DMA Channels |
8
|
8
|
| Number of External Interrupts |
16
|
8
|
| Number of I/O Lines |
17
|
17
|
| Number of Serial I/Os |
3
|
3
|
| Number of Terminals |
24
|
24
|
| Number of Timers |
2
|
3
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Code |
HVQCCN
|
SSOP
|
| Package Equivalence Code |
LCC24,.19SQ,25
|
SSOP24,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| RAM (bytes) |
2048
|
4096
|
| ROM (words) |
4096
|
16384
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
0.9 mm
|
2 mm
|
| Speed |
32 MHz
|
32 MHz
|
| Supply Voltage-Max |
3.8 V
|
3.63 V
|
| Supply Voltage-Min |
3 V
|
1.62 V
|
| Supply Voltage-Nom |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
5 mm
|
5.3 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
3
|
3
|
| Factory Lead Time |
|
7 Weeks
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| RAM (words) |
|
4096
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
0.247 mA
|
|
|
|
Compare EFM32TG110F4-D-QFN24 with alternatives
Compare ATSAML11D14A-YF with alternatives