EFM32GG11B840F1024IQ64-BR
vs
EFM32GG11B840F1024IQ64-AR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SILICON LABORATORIES INC
SILICON LABORATORIES INC
Package Description
QFP-64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2018-08-21
Has ADC
YES
Address Bus Width
Bit Size
32
Boundary Scan
YES
CPU Family
CORTEX-M4
Clock Frequency-Max
50 MHz
DAC Channels
YES
DMA Channels
YES
External Data Bus Width
Format
FLOATING POINT
Integrated Cache
NO
JESD-30 Code
S-PQFP-G64
JESD-609 Code
e3
Length
10 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of DMA Channels
24
Number of I/O Lines
47
Number of Serial I/Os
12
Number of Terminals
64
Number of Timers
13
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
TFQFP
Package Equivalence Code
TQFP64,.47SQ
Package Shape
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
RAM (bytes)
524288
ROM (words)
1048576
ROM Programmability
FLASH
Seated Height-Max
1.2 mm
Speed
72 MHz
Supply Current-Max
200 mA
Supply Voltage-Max
3.8 V
Supply Voltage-Min
1.8 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
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