EFM32GG11B420F2048GL112-BR
vs
EFM32GG11B420F2048IL112-AR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SILICON LABORATORIES INC
SILICON LABORATORIES INC
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2018-08-21
Has ADC
YES
Address Bus Width
28
Bit Size
32
Boundary Scan
YES
CPU Family
CORTEX-M4
Clock Frequency-Max
50 MHz
DAC Channels
YES
DMA Channels
YES
External Data Bus Width
16
Format
FLOATING POINT
Integrated Cache
NO
JESD-30 Code
S-PBGA-B112
JESD-609 Code
e4
Length
10 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of DMA Channels
24
Number of I/O Lines
87
Number of Serial I/Os
12
Number of Terminals
112
Number of Timers
22
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
Package Code
LFBGA
Package Equivalence Code
BGA112,11X11,32
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
RAM (bytes)
524288
ROM (words)
2097152
ROM Programmability
FLASH
Seated Height-Max
1.3 mm
Speed
72 MHz
Supply Voltage-Max
3.8 V
Supply Voltage-Min
3.3 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Terminal Finish
NICKEL GOLD
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Compare EFM32GG11B420F2048GL112-BR with alternatives
Compare EFM32GG11B420F2048IL112-AR with alternatives