EFM32GG11B420F2048GL112-AR
vs
EFM32GG11B420F2048IL112-BR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
28
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
CPU Family |
CORTEX-M4
|
CORTEX-M4
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
16
|
Format |
FLOATING-POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PBGA-B112
|
S-PBGA-B112
|
Length |
10 mm
|
10 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
24
|
24
|
Number of I/O Lines |
87
|
87
|
Number of Serial I/Os |
10
|
12
|
Number of Terminals |
112
|
112
|
Number of Timers |
17
|
22
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA112,11X11,32
|
BGA112,11X11,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
RAM (bytes) |
524288
|
524288
|
ROM (words) |
2097152
|
2097152
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.3 mm
|
1.3 mm
|
Speed |
72 MHz
|
72 MHz
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
3.3 V
|
1.62 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
10 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2018-08-21
|
Samacsys Manufacturer |
|
Silicon Labs
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
NICKEL GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare EFM32GG11B420F2048GL112-AR with alternatives
Compare EFM32GG11B420F2048IL112-BR with alternatives