EFM32G232F128G-E-QFP64R
vs
EFM32G232F128G-E-QFP64
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2017-07-28
|
2017-07-28
|
Samacsys Manufacturer |
Silicon Labs
|
Silicon Labs
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
32
|
32
|
CPU Family |
EFM32
|
EFM32
|
Clock Frequency-Max |
32 MHz
|
32 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
Length |
10 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of I/O Lines |
53
|
53
|
Number of Terminals |
64
|
64
|
Number of Timers |
14
|
14
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFQFP
|
TFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
RAM (bytes) |
16384
|
16384
|
ROM (words) |
131072
|
131072
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Speed |
32 MHz
|
32 MHz
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
10 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
2
|
|
|
|
Compare EFM32G232F128G-E-QFP64R with alternatives
Compare EFM32G232F128G-E-QFP64 with alternatives