EF68A09CM
vs
EF6809E-C
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
STMICROELECTRONICS
|
THOMSON-CSF SEMICONDUCTORS
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bit Size |
8
|
8
|
JESD-30 Code |
R-XDIP-T40
|
R-CDIP-T40
|
JESD-609 Code |
e0
|
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP40,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
1.5 MHz
|
1 MHz
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
MOS
|
HMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
5
|
3
|
Part Package Code |
|
DIP
|
Package Description |
|
,
|
Pin Count |
|
40
|
Address Bus Width |
|
16
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
1 MHz
|
External Data Bus Width |
|
8
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
NO
|
Low Power Mode |
|
NO
|
Supply Voltage-Max |
|
5.25 V
|
Supply Voltage-Min |
|
4.75 V
|
|
|
|
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