EF6809JMB/C
vs
SAB8086-2-P
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
SIEMENS A G
|
Part Package Code |
DIP
|
|
Package Description |
,
|
,
|
Pin Count |
40
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
20
|
Bit Size |
8
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
1 MHz
|
8 MHz
|
External Data Bus Width |
8
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
R-GDIP-T40
|
R-PDIP-T40
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Speed |
1 MHz
|
8 MHz
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HMOS
|
NMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
3
|
2
|
Number of DMA Channels |
|
|
Number of External Interrupts |
|
2
|
Number of Serial I/Os |
|
|
On Chip Data RAM Width |
|
|
RAM (words) |
|
0
|
Supply Current-Max |
|
350 mA
|
|
|
|
Compare EF6809JMB/C with alternatives
Compare SAB8086-2-P with alternatives