EF6809E-JMG/B
vs
CDP1802BCDX
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
THOMSON-CSF COMPSANTS SPECIFIC
|
HARRIS SEMICONDUCTOR
|
Package Description |
,
|
DIP-40
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Base Number Matches |
3
|
4
|
Rohs Code |
|
No
|
Address Bus Width |
|
8
|
Bit Size |
|
8
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
5 MHz
|
External Data Bus Width |
|
8
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
NO
|
JESD-30 Code |
|
R-CDIP-T40
|
JESD-609 Code |
|
e0
|
Low Power Mode |
|
NO
|
Number of DMA Channels |
|
1
|
Number of External Interrupts |
|
1
|
Number of Serial I/Os |
|
|
Number of Terminals |
|
40
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP40,.6
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Qualification Status |
|
Not Qualified
|
RAM (words) |
|
0
|
Speed |
|
5 MHz
|
Supply Current-Max |
|
6 mA
|
Supply Voltage-Max |
|
6.5 V
|
Supply Voltage-Min |
|
4 V
|
Supply Voltage-Nom |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR
|
|
|
|