EDJ1104BBSE-8C-F
vs
EDJ2104BASE-8C-F
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ELPIDA MEMORY INC
|
ELPIDA MEMORY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA,
|
TFBGA,
|
| Pin Count |
78
|
78
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.32
|
8542.32.00.36
|
| Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
| Access Time-Max |
0.4 ns
|
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-PBGA-B78
|
R-PBGA-B78
|
| JESD-609 Code |
e1
|
e1
|
| Length |
11.5 mm
|
11 mm
|
| Memory Density |
1073741824 bit
|
2147483648 bit
|
| Memory IC Type |
DDR DRAM
|
DDR DRAM
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
78
|
78
|
| Number of Words |
268435456 words
|
536870912 words
|
| Number of Words Code |
256000000
|
512000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256MX4
|
512MX4
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.17 mm
|
1.2 mm
|
| Self Refresh |
YES
|
YES
|
| Supply Voltage-Max (Vsup) |
1.575 V
|
1.575 V
|
| Supply Voltage-Min (Vsup) |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
8 mm
|
9 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare EDJ1104BBSE-8C-F with alternatives
Compare EDJ2104BASE-8C-F with alternatives