EDI8M8257C55N6I vs IDT7M4068S30CB feature comparison

EDI8M8257C55N6I Electronic Designs Inc

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IDT7M4068S30CB Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ELECTRONIC DESIGNS INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code unknown not_compliant
Access Time-Max 55 ns 30 ns
JESD-30 Code R-XDMA-T32 R-CDIP-T32
Memory Density 2097152 bit 2097152 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 256KX8 256KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Part Package Code DIP
Package Description 1.700 X 0.600 INCH, CERAMIC, DIP-32
Pin Count 32
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS
I/O Type COMMON
JESD-609 Code e0
Length 43.18 mm
Package Equivalence Code DIP32,.6
Screening Level MIL-STD-883 Class B (Modified)
Seated Height-Max 9.144 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.24 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare EDI8M8257C55N6I with alternatives

Compare IDT7M4068S30CB with alternatives