EDI8LM32513V12AC
vs
FTS8L32512V17AI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ELECTRONIC DESIGNS INC
FORCE TECHNOLOGIES LTD
Reach Compliance Code
unknown
compliant
Access Time-Max
12 ns
12 ns
Additional Feature
TTL COMPATIBLE INPUT OUTPUT
I/O Type
COMMON
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e0
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX32
512KX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.04 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.72 mA
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Base Number Matches
2
1
Part Package Code
LCC
Package Description
QCCJ,
Pin Count
68
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Seated Height-Max
4.572 mm
Compare EDI8LM32513V12AC with alternatives
Compare FTS8L32512V17AI with alternatives