EDI8L24257V12BI
vs
WED8L24258V12BI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE MICROELECTRONICS
WHITE MICROELECTRONICS
Package Description
MO-163, BGA-119
BGA-119
Reach Compliance Code
unknown
unknown
Access Time-Max
12 ns
12 ns
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Memory Density
6291456 bit
6291456 bit
Memory IC Type
SRAM MODULE
STANDARD SRAM
Memory Width
24
24
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX24
256KX24
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
2
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