EDI8G32259V15MMC
vs
EDI8G32259C25MMC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ELECTRONIC DESIGNS INC
ELECTRONIC DESIGNS INC
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
15 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PSMA-N72
R-XSMA-N72
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
8
Number of Terminals
72
72
Number of Words
262144 words
1048576 words
Number of Words Code
256000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX32
1MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SIMM
SIMM
Package Equivalence Code
SSIM72
SSIM72
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
15.24 mm
15.24 mm
Standby Current-Max
0.04 A
0.04 A
Standby Voltage-Min
3 V
4.5 V
Supply Current-Max
1.44 mA
1.28 mA
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
SINGLE
SINGLE
Base Number Matches
2
2
Additional Feature
CONFIGURABLE AS 256K X 32 OR 512K X 16
Number of Functions
1
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V