EDI8G32256C12MMC vs AP32M256M6T-20 feature comparison

EDI8G32256C12MMC White Electronic Designs Corp

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AP32M256M6T-20 Integrated Silicon Solution Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP APTOS SEMICONDUCTOR CORP
Package Description SIMM-64 ,
Reach Compliance Code unknown unknown
Access Time-Max 12 ns 20 ns
JESD-30 Code R-XSMA-N64 R-XZMA-N64
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX32 256KX32
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position SINGLE ZIG-ZAG
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41

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