EDI8F8512C35M6C
vs
DPS512S8BN-35C
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
DPAC TECHNOLOGIES CORP
Package Description
DIP-32
,
Reach Compliance Code
unknown
unknown
Access Time-Max
35 ns
35 ns
I/O Type
COMMON
JESD-30 Code
R-XDMA-T32
R-CDMA-T32
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX8
512KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.04 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.39 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
2
Part Package Code
MODULE
Pin Count
32
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Number of Ports
1
Output Enable
YES
Compare EDI8F8512C35M6C with alternatives
Compare DPS512S8BN-35C with alternatives