EDI8F82048LP85BFI
vs
MS82000RKX-10
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ELECTRONIC DESIGNS INC
MOSAIC SEMICONDUCTOR INC
Reach Compliance Code
unknown
unknown
Access Time-Max
85 ns
100 ns
JESD-30 Code
R-XSMA-L36
R-XSMA-T36
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
36
36
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX8
2MX8
Output Characteristics
3-STATE
Output Enable
YES
YES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
2 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
L BEND
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
2
Package Description
,
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Compare EDI8F82048LP85BFI with alternatives
Compare MS82000RKX-10 with alternatives