EDI8F82046C20M6C
vs
WS512K32-120HCE
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
| Package Description |
DIP-36
|
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
20 ns
|
120 ns
|
| JESD-30 Code |
R-XDMA-T36
|
S-CPGA-P66
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
66
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
2MX8
|
2MX8
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Position |
DUAL
|
PERPENDICULAR
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
CONFIGURABLE AS 512K X 32 OR 1024K X 16
|
| JESD-609 Code |
|
e4
|
| Length |
|
30.1 mm
|
| Package Code |
|
PGA
|
| Seated Height-Max |
|
6.22 mm
|
| Terminal Finish |
|
GOLD
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
30.1 mm
|
|
|
|
Compare EDI8F82046C20M6C with alternatives
Compare WS512K32-120HCE with alternatives