EDI8F82045C85B6C
vs
SYS82000FKXAI-85
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
MOSAIC SEMICONDUCTOR INC
|
Package Description |
DIP-36
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
85 ns
|
85 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-XDMA-T36
|
R-PDIP-T36
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
36
|
36
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
2MX8
|
2MX8
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP36,.6
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.003 A
|
|
Standby Voltage-Min |
4.5 V
|
|
Supply Current-Max |
0.15 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
DIP
|
Pin Count |
|
36
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
|
|
|
Compare EDI8F82045C85B6C with alternatives
Compare SYS82000FKXAI-85 with alternatives