EDI8F82045C70B6C
vs
SYS82000FKXI-70
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ELECTRONIC DESIGNS INC
APTA GROUP INC
Reach Compliance Code
unknown
unknown
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial: +0C to +70C
Industrial: -40C to +85C
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-T36
R-PDMA-T36
JESD-609 Code
e0
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
36
36
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX8
2MX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP36,.6
DIP36,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.003 A
0.00048 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.15 mA
0.109 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Part Package Code
MODULE
Package Description
DIP, DIP36,.6
Pin Count
36
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
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