EDI8F81027C100B6C
vs
DPS1MS8MP-15I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
DPAC TECHNOLOGIES CORP
Package Description
DIP-32
DIP, DIP32,.6
Reach Compliance Code
unknown
unknown
Access Time-Max
100 ns
150 ns
JESD-30 Code
R-XDMA-T32
R-CDMA-T32
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX8
1MX8
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
1
Part Package Code
MODULE
Pin Count
32
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Additional Feature
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS
I/O Type
COMMON
JESD-609 Code
e0
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
NO
Package Code
DIP
Package Equivalence Code
DIP32,.6
Standby Current-Max
0.000135 A
Standby Voltage-Min
2 V
Supply Current-Max
0.1 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare EDI8F81027C100B6C with alternatives
Compare DPS1MS8MP-15I with alternatives