EDI8F32259C35MNC
vs
EDI8G32259C35MNC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ELECTRONIC DESIGNS INC
WHITE ELECTRONIC DESIGNS CORP
Reach Compliance Code
unknown
unknown
Access Time-Max
35 ns
35 ns
Additional Feature
CONFIGURABLE AS 256K X 32 OR 512K X 16
I/O Type
COMMON
COMMON
JESD-30 Code
R-XSMA-N72
R-PSMA-N72
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
32
Number of Functions
1
Number of Terminals
72
72
Number of Words
1048576 words
262144 words
Number of Words Code
1000000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX8
256KX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
SIMM
SIMM
Package Equivalence Code
SSIM72
SSIM72
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
17.272 mm
17.272 mm
Standby Current-Max
0.04 A
0.04 A
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
1.28 mA
1.28 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
SINGLE
SINGLE
Base Number Matches
2
2
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Compare EDI8F32259C35MNC with alternatives