EDI8F32256C35MZC
vs
CYM1841V33PZ-20C
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
35 ns
|
20 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PZIP-T64
|
R-PZMA-T64
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
32
|
32
|
| Number of Terminals |
64
|
64
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX32
|
256KX32
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
ZIP
|
| Package Equivalence Code |
ZIP64/68,.1,.1
|
ZIP64/68,.1,.1
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
14.732 mm
|
14.605 mm
|
| Standby Current-Max |
0.04 A
|
0.07 A
|
| Standby Voltage-Min |
4.5 V
|
3.14 V
|
| Supply Current-Max |
1.28 mA
|
0.34 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
| Base Number Matches |
2
|
1
|
| Number of Functions |
|
1
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3.135 V
|
|
|
|
Compare EDI8F32256C35MZC with alternatives
Compare CYM1841V33PZ-20C with alternatives