EDI8F32256C35MMC
vs
EDI8G32256B12MMC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
ELECTRONIC DESIGNS INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
35 ns
|
12 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PSMA-N64
|
R-XSMA-N64
|
| Memory Density |
8388608 bit
|
8388608 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
32
|
8
|
| Number of Terminals |
64
|
64
|
| Number of Words |
262144 words
|
1048576 words
|
| Number of Words Code |
256000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX32
|
1MX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SIMM
|
SIMM
|
| Package Equivalence Code |
SSIM64
|
SSIM64
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
15.748 mm
|
|
| Standby Current-Max |
0.04 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
1.28 mA
|
1.36 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
2
|
2
|
| Additional Feature |
|
CONFIGURABLE AS 256K X 32
|
| Number of Functions |
|
1
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
Compare EDI8F32256C35MMC with alternatives
Compare EDI8G32256B12MMC with alternatives