EDI88512LPA55F32I vs EDI88512LPA55F32C feature comparison

EDI88512LPA55F32I Microsemi Corporation

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EDI88512LPA55F32C White Electronic Designs Corp

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP WHITE ELECTRONIC DESIGNS CORP
Part Package Code DFP
Package Description CERAMIC, DFP-32 CERAMIC, DFP-32
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX TTL COMPATIBLE INPUTS/OUTPUTS
I/O Type COMMON COMMON
JESD-30 Code R-CDFP-F32 R-CDFP-F32
Length 21.2852 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Equivalence Code FL32,.4 FL32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8448 mm 2.8448 mm
Standby Current-Max 0.002 A 0.002 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.225 mA 0.225 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10.7442 mm 10.7442 mm
Base Number Matches 4 4