EDI88512LPA20B32B
vs
MK48C12AK-15
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
STMICROELECTRONICS
Part Package Code
DFP
QFJ
Package Description
CERAMIC, DFP-32
PLASTIC, LCC-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
20 ns
150 ns
Additional Feature
TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX
I/O Type
COMMON
JESD-30 Code
R-CDSO-G32
R-PQCC-J32
Length
21.2852 mm
13.97 mm
Memory Density
4194304 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
2048 words
Number of Words Code
512000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512KX8
2KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
SOP
QCCJ
Package Equivalence Code
SOP32,.56
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
2.9972 mm
3.55 mm
Standby Current-Max
0.002 A
0.001 A
Standby Voltage-Min
2 V
Supply Current-Max
0.225 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
GULL WING
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
10.8712 mm
11.43 mm
Base Number Matches
5
2
JESD-609 Code
e0
Mixed Memory Type
N/A
Number of Ports
1
Output Enable
YES
Terminal Finish
Tin/Lead (Sn/Pb)
Compare EDI88512LPA20B32B with alternatives
Compare MK48C12AK-15 with alternatives