EDI88512LPA-17MBG vs EDI88512LPA17MBRP feature comparison

EDI88512LPA-17MBG Microsemi Corporation

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EDI88512LPA17MBRP White Electronic Designs Corp

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP WHITE ELECTRONIC DESIGNS CORP
Part Package Code SOJ
Package Description SOJ,
Pin Count 36
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 17 ns 17 ns
JESD-30 Code R-PDSO-J36 R-PDSO-J36
Length 23.495 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1
Number of Terminals 36 36
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOJ SOJ
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 38535Q/M;38534H;883B
Seated Height-Max 3.7592 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm
Base Number Matches 2 1
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code SOJ36,.44
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.18 mA
Terminal Finish Tin/Lead (Sn/Pb)

Compare EDI88512LPA-17MBG with alternatives

Compare EDI88512LPA17MBRP with alternatives