EDI88512LP55CB vs WMS512K8-55CC feature comparison

EDI88512LP55CB Electronic Designs Inc

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WMS512K8-55CC Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ELECTRONIC DESIGNS INC MICROSEMI CORP
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP32,.6 DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.000185 A 0.00045 A
Standby Voltage-Min 2 V 4.5 V
Supply Current-Max 0.075 mA 0.16 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 4
Part Package Code DIP
Package Description DIP-32
Pin Count 32
JESD-609 Code e4
Length 42.8 mm
Reverse Pinout NO
Seated Height-Max 5.13 mm
Terminal Finish Gold (Au)
Width 15.24 mm

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