EDI88512CA55F32I
vs
M5M5408BKR-55HI
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WHITE MICROELECTRONICS
|
MITSUBISHI ELECTRIC CORP
|
Package Description |
CERAMIC, FP-32
|
TSOP1-R, TSSOP32,.56,20
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
55 ns
|
55 ns
|
JESD-30 Code |
R-CDFP-F32
|
R-PDSO-G32
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512KX8
|
512KX8
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DFP
|
TSOP1-R
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
SMALL OUTLINE, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
TSOP
|
Pin Count |
|
32
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e0
|
Length |
|
11.8 mm
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
TSSOP32,.56,20
|
Reverse Pinout |
|
YES
|
Seated Height-Max |
|
1.2 mm
|
Standby Current-Max |
|
0.00002 A
|
Standby Voltage-Min |
|
2 V
|
Supply Current-Max |
|
0.09 mA
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
0.5 mm
|
Width |
|
8 mm
|
|
|
|
Compare EDI88512CA55F32I with alternatives
Compare M5M5408BKR-55HI with alternatives