EDI88512CA55F32B vs K6X4008C1F-MQ55 feature comparison

EDI88512CA55F32B White Electronic Designs Corp

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K6X4008C1F-MQ55 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP SAMSUNG SEMICONDUCTOR INC
Package Description CERAMIC, DFP-32 TSOP2-R,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS
I/O Type COMMON
JESD-30 Code R-CDFP-F32 R-PDSO-G32
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DFP TSOP2-R
Package Equivalence Code FL32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 2.8448 mm 1.2 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.225 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.7442 mm 10.16 mm
Base Number Matches 4 1
Part Package Code TSOP2
Pin Count 32
Length 20.95 mm

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