EDI88512CA25F36B
vs
EDI88512CA25F36
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
MICROSEMI CORP
|
| Package Description |
CERAMIC, DFP-36
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
25 ns
|
|
| Additional Feature |
TTL COMPATIBLE INPUTS/OUTPUTS
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-CDFP-F36
|
|
| Length |
23.368 mm
|
|
| Memory Density |
4194304 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
36
|
|
| Number of Words |
524288 words
|
|
| Number of Words Code |
512000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
512KX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Code |
DFP
|
|
| Package Equivalence Code |
FL36,.5
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
3.175 mm
|
|
| Standby Current-Max |
0.025 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
0.225 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Form |
FLAT
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
12.954 mm
|
|
| Base Number Matches |
5
|
2
|
|
|
|