EDI88512CA25F36
vs
EDI88512LPA25F32C
feature comparison
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
MERCURY SYSTEMS INC
|
MERCURY SYSTEMS INC
|
| Package Description |
,
|
CERAMIC, DFP-32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Base Number Matches |
5
|
1
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
25 ns
|
| Additional Feature |
|
TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX
|
| JESD-30 Code |
|
R-CDFP-F32
|
| Length |
|
21.2852 mm
|
| Memory Density |
|
4194304 bit
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
32
|
| Number of Words |
|
524288 words
|
| Number of Words Code |
|
512000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
512KX8
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
DFP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLATPACK
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.8448 mm
|
| Supply Current-Max |
|
0.225 mA
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
FLAT
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
10.7442 mm
|
|
|
|
Compare EDI88512CA25F36 with alternatives
Compare EDI88512LPA25F32C with alternatives