EDI8833LP55LC vs MT5C2564F-70L/883C feature comparison

EDI8833LP55LC Electronic Designs Inc

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MT5C2564F-70L/883C Micross Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer ELECTRONIC DESIGNS INC MICROSS COMPONENTS
Reach Compliance Code unknown compliant
Access Time-Max 55 ns 70 ns
JESD-30 Code R-CQCC-N32 R-CDFP-F28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 4
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 28
Number of Words 32768 words 65536 words
Number of Words Code 32000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8 64KX4
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD FLAT
Terminal Position QUAD DUAL
Base Number Matches 1 1
Part Package Code DFP
Package Description CERAMIC, FLATPACK-28
Pin Count 28
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Screening Level MIL-STD-883
Seated Height-Max 3.302 mm
Terminal Pitch 1.27 mm
Width 10.16 mm

Compare EDI8833LP55LC with alternatives

Compare MT5C2564F-70L/883C with alternatives