EDI88130PS55FB vs EDI88130LPS55FB feature comparison

EDI88130PS55FB Electronic Designs Inc

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EDI88130LPS55FB Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ELECTRONIC DESIGNS INC MICROSEMI CORP
Reach Compliance Code unknown unknown
Access Time-Max 55 ns 55 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type COMMON COMMON
JESD-30 Code R-CDFP-F32 R-CDFP-F32
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Equivalence Code FL32,.5 FL32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883
Standby Current-Max 0.005 A 0.002 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.15 mA 0.2 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 5
Part Package Code DFP
Package Description CERAMIC, DFP-32
Pin Count 32
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Length 20.828 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.9464 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.414 mm

Compare EDI88130PS55FB with alternatives

Compare EDI88130LPS55FB with alternatives