EDI88130LPS55NI vs P4C1256L-70DI feature comparison

EDI88130LPS55NI Microsemi Corporation

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P4C1256L-70DI Pyramid Semiconductor Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code SOJ DIP
Package Description CERAMIC, SOJ-32 0.300 INCH, CERAMIC, DIP-28
Pin Count 32 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 70 ns
Additional Feature BATTERY BACKUP OPERATION LG-MAX
I/O Type COMMON
JESD-30 Code R-CDSO-J32 R-CDIP-T28
Length 21.082 mm 37.719 mm
Memory Density 1048576 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 131072 words 32768 words
Number of Words Code 128000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code SOJ DIP
Package Equivalence Code SOJ32,.44
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.937 mm 5.715 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 11.05 mm 7.62 mm
Base Number Matches 1 4
JESD-609 Code e0
Terminal Finish TIN LEAD

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