EDI88130LPS35CC vs 5962-8959811MXX feature comparison

EDI88130LPS35CC Electronic Designs Inc

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5962-8959811MXX Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ELECTRONIC DESIGNS INC MICROSEMI CORP
Reach Compliance Code unknown compliant
Access Time-Max 35 ns 35 ns
Additional Feature BATTERY BACKUP OPERATION
I/O Type COMMON
JESD-30 Code R-CDIP-T32 R-CDIP-T32
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00075 A
Standby Voltage-Min 2 V
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 8
Part Package Code DIP
Package Description 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Screening Level MIL-STD-883
Width 10.16 mm

Compare EDI88130LPS35CC with alternatives

Compare 5962-8959811MXX with alternatives