EDI88130LPS35CC
vs
5962-8959811MXX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ELECTRONIC DESIGNS INC
MICROSEMI CORP
Reach Compliance Code
unknown
compliant
Access Time-Max
35 ns
35 ns
Additional Feature
BATTERY BACKUP OPERATION
I/O Type
COMMON
JESD-30 Code
R-CDIP-T32
R-CDIP-T32
JESD-609 Code
e0
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.00075 A
Standby Voltage-Min
2 V
Supply Current-Max
0.2 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
8
Part Package Code
DIP
Package Description
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count
32
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Screening Level
MIL-STD-883
Width
10.16 mm
Compare EDI88130LPS35CC with alternatives
Compare 5962-8959811MXX with alternatives