EDI88130LPS15FB
vs
EDI88128LPS15LI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DFP
QFJ
Package Description
DFP,
CERAMIC, LCC-32
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
JESD-30 Code
R-CDFP-F32
R-CQCC-N32
Length
20.828 mm
21.082 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
2.9464 mm
2.4384 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
FLAT
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
10.414 mm
10.16 mm
Base Number Matches
1
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
SOLCC32,.4
Standby Current-Max
0.002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.3 mA
Compare EDI88130LPS15FB with alternatives
Compare EDI88128LPS15LI with alternatives