EDI88130CS55CI
vs
P4C1024-55C6MB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
WHITE MICROELECTRONICS
PYRAMID SEMICONDUCTOR CORP
Package Description
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code
unknown
compliant
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-CDIP-T32
R-CDIP-T32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
5
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
32
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
I/O Type
COMMON
JESD-609 Code
e0
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
YES
Package Equivalence Code
DIP32,.6
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.715 mm
Standby Voltage-Min
4.5 V
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare EDI88130CS55CI with alternatives
Compare P4C1024-55C6MB with alternatives