EDI88130CS55CC vs 5962-8959834MXC feature comparison

EDI88130CS55CC Mercury Systems Inc

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5962-8959834MXC Micross Components

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MERCURY SYSTEMS INC MICROSS COMPONENTS
Package Description DIP-32 DIP,
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Length 40.64 mm 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 3.937 mm 4.34 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 5 1
Part Package Code DIP
Pin Count 32
JESD-609 Code e4
Qualification Status Not Qualified
Screening Level MIL-STD-883
Terminal Finish GOLD

Compare EDI88130CS55CC with alternatives

Compare 5962-8959834MXC with alternatives