EDI88128LPS15TI vs EDI88128LPS15LB feature comparison

EDI88128LPS15TI Microsemi Corporation

Buy Now Datasheet

EDI88128LPS15LB White Electronic Designs Corp

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP WHITE ELECTRONIC DESIGNS CORP
Part Package Code DIP
Package Description 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 CERAMIC, LCC-32
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.B 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T32 R-CQCC-N32
Length 40.64 mm 21.082 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Equivalence Code DIP32,.4 SOLCC32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.937 mm 2.4384 mm
Standby Current-Max 0.002 A 0.005 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.3 mA 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 10.16 mm 10.16 mm
Base Number Matches 4 3
Screening Level MIL-STD-883

Compare EDI88128LPS15TI with alternatives