EDI88128CS25FB
vs
5962-8959812MTX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
WHITE ELECTRONIC DESIGNS CORP
|
| Package Description |
CERAMIC, DFP-32
|
CERAMIC, FP-32
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
25 ns
|
25 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-CDFP-F32
|
R-CDFP-F32
|
| Length |
20.828 mm
|
20.828 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
128KX8
|
128KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL32,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-STD-883
|
| Seated Height-Max |
2.9464 mm
|
3.175 mm
|
| Standby Current-Max |
0.01 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
0.2 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
10.414 mm
|
10.414 mm
|
| Base Number Matches |
5
|
6
|
|
|
|