EDI8810H70DB vs P4C164-70CWI feature comparison

EDI8810H70DB Electronic Designs Inc

Buy Now Datasheet

P4C164-70CWI Pyramid Semiconductor Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ELECTRONIC DESIGNS INC PYRAMID SEMICONDUCTOR CORP
Reach Compliance Code unknown compliant
Access Time-Max 70 ns 70 ns
Additional Feature AUTOMATIC POWER-DOWN LG-MAX
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.0002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.07 mA 0.145 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Package Description DIP,
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.41
Length 37.846 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Compare EDI8810H70DB with alternatives

Compare P4C164-70CWI with alternatives