EDI7G341MC100BNC vs EDI7F2341MC80BNC feature comparison

EDI7G341MC100BNC Microsemi Corporation

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EDI7F2341MC80BNC Electronic Designs Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP ELECTRONIC DESIGNS INC
Part Package Code SIMM
Package Description ,
Pin Count 80
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 80 ns
JESD-30 Code R-XSMA-N80 R-XSMA-N80
Memory Density 33554432 bit 67108864 bit
Memory IC Type FLASH MODULE FLASH MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 80 80
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 1MX32 2MX32
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form NO LEAD NO LEAD
Terminal Position SINGLE SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
Additional Feature TTL COMPATIBLE I/O

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