EDI2DL32256V38BC
vs
IS61SPD25632D-150B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WHITE MICROELECTRONICS
INTEGRATED SILICON SOLUTION INC
Package Description
BGA-119
PLASTIC, BGA-119
Reach Compliance Code
unknown
compliant
Access Time-Max
3.8 ns
3.8 ns
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
CACHE SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX32
256KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.465 V
3.63 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
119
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Clock Frequency-Max (fCLK)
150 MHz
I/O Type
COMMON
JESD-609 Code
e0
Length
22 mm
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Seated Height-Max
2.41 mm
Standby Current-Max
0.105 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.37 mA
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
14 mm
Compare EDI2DL32256V38BC with alternatives
Compare IS61SPD25632D-150B with alternatives