EDB5432BEBH-1DAUT-F vs W979H2KBQX2I feature comparison

EDB5432BEBH-1DAUT-F Micron Technology Inc

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W979H2KBQX2I Winbond Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICRON TECHNOLOGY INC WINBOND ELECTRONICS CORP
Package Description VFBGA-134 VFBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode SINGLE BANK PAGE BURST FOUR BANK PAGE BURST
Additional Feature SELF REFRESH; IT ALSO REQUIRES 1.8V NOM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
JESD-30 Code R-PBGA-B134 S-PBGA-B168
Length 11.5 mm 12 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type LPDDR2 DRAM LPDDR2 DRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 134 168
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX32 16MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Seated Height-Max 1 mm 0.8 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.3 V 1.3 V
Supply Voltage-Min (Vsup) 1.14 V 1.14 V
Supply Voltage-Nom (Vsup) 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10 mm 12 mm
Base Number Matches 1 1
Samacsys Manufacturer Winbond

Compare EDB5432BEBH-1DAUT-F with alternatives

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