EBE51UD8ABFA-4C-E
vs
M378B6573EZ0-CG8
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
DIMM, DIMM244,24
|
DIMM, DIMM240,40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.36
|
8542.32.00.36
|
| Access Time-Max |
0.6 ns
|
|
| Clock Frequency-Max (fCLK) |
400 MHz
|
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDMA-N244
|
R-XDMA-N240
|
| Memory Density |
4294967296 bit
|
4294967296 bit
|
| Memory IC Type |
DDR DRAM MODULE
|
SYNCHRONOUS DRAM MODULE
|
| Memory Width |
64
|
64
|
| Number of Terminals |
244
|
240
|
| Number of Words |
67108864 words
|
67108864 words
|
| Number of Words Code |
64000000
|
64000000
|
| Operating Temperature-Max |
85 °C
|
95 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64MX64
|
64MX64
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM244,24
|
DIMM240,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Standby Current-Max |
0.064 A
|
|
| Supply Current-Max |
2.4 mA
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.6 mm
|
1 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIMM
|
| Pin Count |
|
240
|
| Access Mode |
|
SINGLE BANK PAGE BURST
|
| Additional Feature |
|
AUTO/SELF REFRESH
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Operating Mode |
|
SYNCHRONOUS
|
| Self Refresh |
|
YES
|
| Supply Voltage-Max (Vsup) |
|
1.575 V
|
| Supply Voltage-Min (Vsup) |
|
1.425 V
|
|
|
|
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