DV74LS00N vs SN74LS00JS feature comparison

DV74LS00N avg Semiconductors

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SN74LS00JS Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AVG SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP14(UNSPEC) DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Length 18.86 mm 19.495 mm
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -10 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14(UNSPEC) DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 4.4 mA
Prop. Delay@Nom-Sup 15 ns
Propagation Delay (tpd) 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.69 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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